| 摘要 |
In a device of the invention, an SMIF type mini-environment ( 1 ) can be connected onto a purge station ( 2 ). The purge station comprises a leaktight purge compartment ( 2 b) whose top face includes a closable transfer passage ( 2 c) facing the bottom face ( 1 b) of the mini-environment pod ( 1 ). An elevator ( 4 ) is suitable for vertically displacing the bottom wall ( 1 b) of the mini-environment pod ( 1 ) when coupled thereto, simultaneously moving the stack ( 3 ) of substrate wafers carried by the bottom wall ( 1 c) so as to introduce them together into the leaktight purge compartment ( 2 b). The stack ( 3 ) of substrate wafers is then purged inside a leaktight purge compartment ( 2 b) of the purge station ( 2 ), while simultaneously purging the mini-environment pod ( 1 ). This provides purging that is much more effective and much faster, thus encouraging the use of SMIF mini-environment pods in microelectronic processes.
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