发明名称 MOISTURE-CURABLE HOT-MELT ADHESIVE
摘要 <p>A moisture-curable hot-melt adhesive which comprises a hot-melt urethane prepolymer (A) containing isocyanate groups, an acidic ester (B) of phosphoric acid, and at least one silane coupling agent (C) selected from the group consisting of a silane coupling agent (c-1) having an epoxy group and a silane coupling agent (c-2) having a mercapto group, wherein the hot-melt urethane prepolymer (A) is one obtained by reacting one or more polyols with a polyisocyanate and the polyols comprise at least 20 wt.% polyester polyol. The moisture-curable hot-melt adhesive contains no organic solvents causative of the sick-house problem and is less harmful to the environment. It is useful especially in the field of interior building materials.</p>
申请公布号 WO2005068576(A1) 申请公布日期 2005.07.28
申请号 WO2005JP00466 申请日期 2005.01.17
申请人 DAINIPPON INK AND CHEMICALS, INC.;FUJIWARA, TOYOKUNI;MINAMIDA, YUKIHIKO 发明人 FUJIWARA, TOYOKUNI;MINAMIDA, YUKIHIKO
分类号 C08G18/10;(IPC1-7):C09J175/04;C09J11/06 主分类号 C08G18/10
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