发明名称 INSULATED WIRE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an insulating wire in which thick-filming of an enamel layer can be realized without reducing adhesion strength of the conductor of the insulating wire and the enamel layer. SOLUTION: This is the insulating wire which comprises at least one layer of enamel-baked layer on the outer periphery of a conductor and at least one layer of extrusion coating resin layer on the outside of it and the total of the thickness of the enamel-baked layer and the extrusion coating resin layer is 60μm or more. Then, in this insulating wire, the thickness of enamel-baked layer is made 50μm or less. Furthermore, in this insulating wire, the extrusion coating resin layer is made of a resin material which has a tensile modulus of elasticity of 1,000 MPa or more at 25°C and a tensile modulus of elasticity of 10 MPa or more at 250°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005203334(A) 申请公布日期 2005.07.28
申请号 JP20040169163 申请日期 2004.06.07
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TAKAHASHI RIKA;AOI TSUNEO;MESAKI MASAKAZU;FUJIWARA MASARU
分类号 H01B7/02;H01B7/00;H01B13/00;H01B13/14;H01B13/16;(IPC1-7):H01B7/02 主分类号 H01B7/02
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