| 摘要 |
PROBLEM TO BE SOLVED: To stably ensure prescribed field vision characteristics without requiring any additional process such as optical axis adjustment by reliably and easily improving optical device positioning accuracy. SOLUTION: In the periphery of a region planned for mounting a thermopile array chip 7 on a circuit board 6 having a conductor pattern 9, at locations corresponding to the four corners of orthogonally meeting edges of the thermopile array chip 7, chip positioning protrusions 10 are formed in advance on the conductor pattern 9 on the circuit board 6, whereto the thermopile array chip 7 is to be soldered. The thermopile array chip 7 is mounted in the prescribed region on the circuit board 6 with the chip positioning protrusions 10 serving as fit-in guides. COPYRIGHT: (C)2005,JPO&NCIPI
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