发明名称 |
Method and resulting structure for manufacturing semiconductor substrates |
摘要 |
A semiconductor wafer composite is used as a basis for fabricating semiconductor chips, especially compound semiconductor devices. The semiconductor wafer composite advantageously comprises a metallic substrate 210 and multiple semiconductor tiles 220 bonded to the surface of the metallic substrate 210. The semiconductor wafer composite is effectively used as a single large semiconductor wafer for volume fabrication, and can be used to fabricate semiconductor devices in a similar manner.
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申请公布号 |
US2005160972(A1) |
申请公布日期 |
2005.07.28 |
申请号 |
US20050050010 |
申请日期 |
2005.02.02 |
申请人 |
COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANIZATION |
发明人 |
CUNNINGHAM SHAUN J. |
分类号 |
C30B23/00;C30B25/00;C30B28/12;C30B28/14;H01L21/00;H01L21/20;H01L21/301;H01L21/304;H01L21/44;H01L21/46;H01L21/48;H01L21/50;H01L21/60;H01L21/768;H01L21/78;H01L23/14;H01L23/373;H01L23/492;H01L23/544;H01L23/552;(IPC1-7):C30B23/00 |
主分类号 |
C30B23/00 |
代理机构 |
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代理人 |
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地址 |
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