| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip lead frame module. <P>SOLUTION: There are formed common electric pins that are selectively provided among a plurality of lead frame units to directly interconnect them and independent electric pins capable of individually connecting with electric substrates (such as printed circuit boards). They form chip lead frames capable of mounting a plurality of chips, respectively. The common signals of each chip are connected by the common electric pins, and then transmitted to the electric substrates. Independent signals are transmitted from the independent electric pins via the electric substrates, and consequently the number of layers to be used and the number of wiring of the electric substrates are reduced to further thin the electric substrates. Moreover, spaces for use are saved to serve for planning/carrying out other functional structures and equipment. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
