| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method not requiring a high technique or apparatus for precise alignment between the substrate main surfaces or incurring an increase in the element manufacturing cost. SOLUTION: The dicing method comprises a dividing step wherein a substrate with electrodes formed at least on one of its main surfaces is divided by a first dicing blade which contacts with the electrodes, and a step wherein a second dicing blade which is thinner than the first dicing blade rotates and follows the groove formed in the dividing step. COPYRIGHT: (C)2005,JPO&NCIPI |
