METHOD FOR PRODUCING REDUCED-THICKNESS ELECTRONIC COMPONENTS

摘要

The invention relates to a method for producing reduced-thickness electronic components. The inventive method consists in placing at least one electronic component (1) by the active face thereof provided with electric contacts (10, 11) on the top face (3) of a support (2) which is provided with electric contacts (5, 6) and with connection jacks (7, 8) on the lower face thereof. Said connection jacks are electrically connected to the electric contacts (5, 6) on the top face of said support by applying a deformable adhesive film (19) to the free external surface of the component (1) and to the top surface (3) of the support and by thinning the top surface of the electronic component, which is opposite to the active surface (12). Said invention can be used for electronic engineering.