发明名称 Substrate treating apparatus and method
摘要 A substrate treating apparatus feeds a treating solution to a substrate while transferring the substrate, and treats the surfaces of the substrate. The substrate treating apparatus includes feed rollers, treating drums, and spray units. The feed rollers transfer the substrate. The treating drums treat the surfaces of the substrate. The spray units feed the treating solution to the substrate. The feed rollers are disposed so as to transfer the substrate with the substrate plane of the substrate being vertically oriented. The treating drums are respectively disposed on the opposite surface sides of the substrate with each outer circumferential surface being in sliding contact with the surface of the substrate. The spray units are disposed on the opposite sides of the direction of transfer of the substrate.
申请公布号 US2005161157(A1) 申请公布日期 2005.07.28
申请号 US20050042737 申请日期 2005.01.25
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 MURAMATSU SHIGETSUGU;KYOZUKA MASAHIRO;KOMATSU MOTOYUKI
分类号 B05C1/08;B05C3/10;B05C13/02;B05D3/12;B05D5/00;C23F1/00;H01L21/02;H05K3/00;(IPC1-7):C23F1/00 主分类号 B05C1/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利