ENCAPSULATION ASSEMBLY FOR ELECTRONIC DEVICES

摘要

Describe are encapsulation assemblies useful for electronic device, having a substrate and an electrically active area, the encapsulation assembly comprising a barrier sheet; and a barrier structure that extends from the sheet, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. In some embodiments, the barrier structure is designed to be used with adhesives to bond the encapsulation assembly to the electronic device. Gettering materials may be optionally used.