A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.
申请公布号
WO2005051061(A3)
申请公布日期
2005.07.28
申请号
WO2004US36758
申请日期
2004.11.03
申请人
ADC TELECOMMUNICATIONS, INC.;CLARK, GORDON, P.;MATTSON, LOREN, J.