| 摘要 |
PROBLEM TO BE SOLVED: To make high in processing speed and low in noise inexpensively in various electronic equipment by inexpensively supplying an optical printed circuit board for optical wiring, a surface mounting type semiconductor package, and a mother board. SOLUTION: This optical printed circuit board uses: (a) a hardening resin which is characterized in that it has thermosetting or ultraviolet ray setting property, with Tg≥130°C at completion of setting; and (b) a transparent plastic composite sheet which is characterized in that a filamentary inorganic filler is the essential component, that a straight light transmissivity in the ray of 850 nm wavelength is≥40%, and that a coefficient of thermal expansion at 25-130°C is≤40 ppm/°C. This surface mounting type semiconductor package uses the optical printed circuit board, and also this mother board uses the semiconductor package. COPYRIGHT: (C)2005,JPO&NCIPI |
