| 摘要 |
PROBLEM TO BE SOLVED: To restrain a supported semiconductor wafer from being broken in transfer, for example, of an intermediate structure wherein a supporting disc is stuck to the semiconductor wafer. SOLUTION: The manufacturing method of a semiconductor device has a process for reducing the diameter of a semiconductor wafer 32 of a diameter (L1) which can be treated in an existing installation, a process for sticking the semiconductor wafer 32 whose diameter is reduced to a semiconductor wafer supporting disc 22 having a diameter (L2) which can be treated in an existing installation and a process for treating the semiconductor wafer 32 stuck to the semiconductor wafer supporting disc 22. COPYRIGHT: (C)2005,JPO&NCIPI |
