| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state image pickup device capable of significantly eliminating defects in image in dicing processing without deteriorating optical characteristics of the solid-state image pickup device. SOLUTION: The method of manufacturing the solid-state image pickup device comprises a preparation process for preparing a semiconductor wafer formed with a plurality of solid-state image pickup devices; a rear surface polishing process for polishing the rear surface of the semiconductor wafer; an attaching process for attaching the semiconductor wafer to a dicing ring via a dicing tape; a hydrophilic process for applying hydrophilic treatment to the semiconductor wafer which is attached to the dicing ring, and to the adhesive material of the dicing tape; and a dicing process for dicing the semiconductor wafer, which is subjected to the hydrophilic treatment by a dicing blade, and cleaning the solid-state image pickup devices causing little damage to the solid-state image pickup devices, to remove a foreign matter that may attach thereto during the dicing. COPYRIGHT: (C)2005,JPO&NCIPI |
