| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and a manufacturing method of the same by which the propagation loss of a signal in a skin effect is suppressed by sufficiently securing adhesiveness of a board and a Cu alloy foil. SOLUTION: The circuit board is obtained by sticking the board 2 and the Cu alloy foil 1 to each other. The Cu alloy foil 1 is an alloy mainly comprising Cu and containing at least one kind of element selected from a group comprising Ti, Mo, Ni, Al and Ag by 0.5 to 5.0 wt % in total. COPYRIGHT: (C)2005,JPO&NCIPI |
