| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure having high reliability, wherein corrosion and migration are not generated in a wiring pattern even when ICs are packaged by using a thermosetting resin composition as a resin composition for adhesion, and also to provide an electrooptical apparatus provided with the packaging structure, an electronic device provided with the electrooptical apparatus. SOLUTION: When the ICs 4 and 5 are packaged in IC packaging areas 40 and 50, an anisotropic conductive film 9 having the surface area equal to the flat size of the ICs 4 and 5 is used and the ICs 4 and 5 and the anisotropic conductive film 9 are nearly two-dimensionally superposed on each other in all the region of the periphery of the ICs 4 and 5. Thereby, when the ICs 4 and 5 are thermocompression bonded by a thermocompression head, the thermosetting resin contained in the anisotropic conductive film 9 is completely hardened by heat transmitted from the ICs 4 and 5, and an unreacted portion does not exist. COPYRIGHT: (C)2005,JPO&NCIPI
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