ELECTRONIC COMPONENT WITH CAVITY FILLERS MADE FROM THERMOPLAST AND METHOD FOR PRODUCTION THEREOF

摘要

Electronic component (1) has external contacts (10) and semiconductor chip (2) with flip-chip contacts (3) and active surface (4) fixed on contact connecting surfaces (5) of rewiring substrate (6). The intermediate chamber (7) formed by the flip-chip contacts between substrate and semiconductor chip has thermoplastic material (8) as filler (9). The glass transition temperature of the thermoplastic material lies below the melting temperature of a solder material of the external contacts. An Independent claim is also included for a process for the production of an electronic component.