发明名称 Heatsinking of optical subassembly and method of assembling
摘要 An optical transceiver has a housing (12), a circuit board (14), an optical subassembly (15,16) and a heat wick (18). The circuit board (14) is configured to be received within the housing (12). The optical subassembly has a can and a barrel, and the optical subassembly is mechanically supported on the housing and electrically coupled to the circuit board. The heat wick (18) is thermally coupled between the can of the optical assembly and the housing. <??>The housing includes a slot through which the flange of the heat wick extends, and wherein the flange is bent over onto a surface of the housing to thermally couple the heat wick to the housing. <IMAGE>
申请公布号 EP1557704(A2) 申请公布日期 2005.07.27
申请号 EP20050075047 申请日期 2005.01.06
申请人 INFINEON TECHNOLOGIES AG 发明人 LARSON, ERIC R.
分类号 G02B6/42 主分类号 G02B6/42
代理机构 代理人
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