发明名称 Etch resist using printer technology
摘要 The present invention provides a printer and an inexpensive method for producing a printed circuit board using a printer configured to facilitate printing at least directly on a copper-clad substrate. The method includes the steps of feeding a copper-clad substrate into the printer, printing an inverse circuit image on the copper-clad substrate, allowing the inverse circuit image to dry, metalizing the copper-clad substrate to adhere a resist mask to exposed, uninked copper to form a metalized circuit image, and etching the copper-clad substrate that has been metalized to remove copper that forms the inverse circuit image.
申请公布号 US6921550(B2) 申请公布日期 2005.07.26
申请号 US20030716274 申请日期 2003.11.18
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 DEHAVEN MAXWELL S.
分类号 B41J3/407;H05K3/00;H05K3/06;H05K3/10;(IPC1-7):B05D5/12 主分类号 B41J3/407
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