发明名称 Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
摘要 A MEMS device such as a grating light valve(TM) light modulator is athermalized such that the force required to deflect the movable portion of the MEMS device remains constant over a range of temperatures. In MEMS embodiments directed to a grating light valve(TM) light modulator, a ribbon is suspended over a substrate, and the ribbon tension is kept constant over a temperature range by adjusting the aggregate thermal coefficient of expansion of the ribbon to match the aggregate thermal coefficient of expansion of the substrate. Various opposition materials have an opposite thermal coefficient of expansion as the aluminum layer of a grating light valve(TM) light modulator ribbon, using the thermal coefficient of expansion of the substrate as a zero coefficient reference. The adjustment of the thermal coefficient of expansion of the ribbon can be performed variously by thickening existing layers of opposition material or adding additional layers of new opposition material to the ribbon, or reducing the aluminum in aluminum layer. The aluminum layer may be reduced variously by reducing the thickness of the aluminum layer, or reducing the surface area that the aluminum covers, or reducing both the surface area and the thickness. Embodiments may combine the reduction of aluminum with the use of opposition materials.
申请公布号 US6922272(B1) 申请公布日期 2005.07.26
申请号 US20030367440 申请日期 2003.02.14
申请人 SILICON LIGHT MACHINES CORPORATION 发明人 DE GROOT WILHELMUS;MAHESHWARI DINESH
分类号 B81B3/00;B81C1/00;G02B26/08;(IPC1-7):G02B26/00 主分类号 B81B3/00
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