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发明名称
AIR CAVITY WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING THEREOF
摘要
申请公布号
KR20050075949(A)
申请公布日期
2005.07.26
申请号
KR20040003689
申请日期
2004.01.19
申请人
S-PACKAGE SOLUTION CO., LTD.
发明人
LEE, WON OH;CHOI, YOUN SIK
分类号
H01L23/04;(IPC1-7):H01L23/04
主分类号
H01L23/04
代理机构
代理人
主权项
地址
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