发明名称 |
Heat releasing member, package for accommodating semiconductor element and semiconductor device |
摘要 |
A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.
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申请公布号 |
US6921971(B2) |
申请公布日期 |
2005.07.26 |
申请号 |
US20040758302 |
申请日期 |
2004.01.15 |
申请人 |
KYOCERA CORPORATION |
发明人 |
BASHO YOSHIHIRO;MORI RYUJI;MIYAUCHI MASAHIKO |
分类号 |
H01L23/057;H01L23/24;H01L23/367;H01L23/373;(IPC1-7):H01L23/10;H01L23/48 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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