Method for testing high power SMD type IC with method for making manual and automation test base

摘要

A method for testing a high power SMD type IC with a method for making manual and automation test base includes the following steps: provide a test socket for the SMD type IC; inversely place the SMD type IC on a lower base of the test socket in a way of the character side thereof facing downward and the connection pins facing upward; and place an upper base on the SMD type IC and the lower base so as to be fixed. By way of the SMD type IC being inversely placed, it is possible for the connection pins of the IC to increase the area of the connection pins on the IC contacting with the connection pins of lower base in the test socket and it is possible for the 8° slant angle of each connection pin on the IC not to become damaged while the IC 1 is fixed to the test socket forcefully. In this way, the contact impedance of each connection pin can be lowered such that the test socket can endure greater current during the high power SMD type IC being tested.