发明名称 |
Component mounting method employing temperature maintenance of positioning apparatus |
摘要 |
A component mounting method for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.
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申请公布号 |
US6920687(B2) |
申请公布日期 |
2005.07.26 |
申请号 |
US20010007821 |
申请日期 |
2001.12.05 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAKANO TOMOYUKI;ODERA KOJI;KURIBAYASHI TAKESHI |
分类号 |
H05K13/08;(IPC1-7):H05K3/30 |
主分类号 |
H05K13/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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