Device for polishing outer peripheral edge of semiconductor wafer

摘要

A polishing machine for a peripheral edge of a semiconductor wafer comprises a rotary mechanism 2 which rotates a stack 1 of semiconductor wafers 4 mounted thereon, and a polishing mechanism 3 which is arranged to be movable in the radial direction of the rotary mechanism 2 and polishes the peripheral edges of the rotating semiconductor wafers 4 by means of contactless polishing. Minute gaps s are formed between the rotary column 10 of the polishing mechanism 3 and the stack 1 of semiconductor wafers 4 , and polishing solution is drawn into these minute gaps s. The peripheral edges of the semiconductor wafers 4 are polished by means of contactless polishing, using polishing abrasive particles included in polishing solution.