| 摘要 |
PURPOSE: A method for fabricating an Au-Sn solder layer and an Au-Sn solder bump is provided to simplify a fabrication process and reduce a manufacturing cost by depositing an Au layer and an Sn layer and performing a heat treatment process. CONSTITUTION: An Au/Sn laminating structure(70) is formed by depositing Au and Sn on a metallic substance. The Au/Sn laminating structure(70) is heated under the temperature of 280 degrees centigrade. The alloy of Sn and Au is formed by using the liquefied Sn and a solid state of Au. An Au/Sn/Au laminating structure is formed by depositing Au and Sn on the metal substance and depositing Au thereon. The Au/Sn/Au laminating structure is heated under the temperature of 280 degrees centigrade. The alloy of Sn and Au is formed by using the liquefied Sn and the solid state of Au. |
