Procedure for inserting electronic chips in layer of fibrous material uses wet fibrous layers obtained from suspension bath with chips embedded in them

摘要

The procedure consists of forming a first wet fibrous layer (4) from a bath (2) of fibres suspended in a liquid, and applying electronic chips (5) to the wet layer before the finishing stages, pressing them into the fibrous layer surface. An additional INDEPENDENT CLAIM is included for a variant in which the first fibrous layer is covered with a second one (15) after the chips have been applied, the chips being carried by a supporting strip with cells in which they are held by suction and released by gravity, or transported by stickers or a strip. A further INDEPENDENT CLAIM is for cavities to be made in the fibrous layers to receive the electronic chips.