| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove power noise, to improve a characteristic of IC, to reduce external bypass capacitors or to reduce capacity, to reduce the mounting area of an IC package, and to reduce external component cost and fitting cost by using a structure of an IO cell. SOLUTION: A bypass capacitor is formed on the IO cell arranged at the peripheral part of the IC chip with MIM capacitances (73, 74, 75) and (83, 84, 85). The bypass capacitors are directly formed on a VDD power wiring 9 and a VSS power wiring 10 inside the IC chip. Thus, power noise can efficiently be removed, the characteristic of IC can be improved, and the external bypass capacitors can be reduced or capacity can be reduced with such constitution. COPYRIGHT: (C)2005,JPO&NCIPI
|
