发明名称 |
Cooling device, electronic apparatus, display unit, and method of producing cooling device |
摘要 |
A cooling device includes a flow-path substrate, an intermediate substrate, and a lid-substrate each made of a polyimide resin, and a condenser substrate incorporated into holes of the intermediate substrate and an evaporator substrate which are made of a metal having a high thermal conductivity, whereby heat from a heat source can be enclosed into the evaporator substrate and the condenser substrate, so that the quantity of the latent heat can be substantially increased.
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申请公布号 |
US2005157452(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
US20050073627 |
申请日期 |
2005.03.08 |
申请人 |
SONY CORPORATION |
发明人 |
OHMI MOTOSUKE;KATO EISAKU;TONOSAKI MINEHIRO |
分类号 |
F25D9/00;F28D15/02;H01L23/427;H05K7/20;(IPC1-7):F16B4/00 |
主分类号 |
F25D9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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