发明名称 FILM FORMING DEVICE AND FILM FORMING METHOD
摘要 <p>Throughput in a film forming process is improved, and simultaneously, a thin film of excellent quality is produced at low cost. A film forming device has a film forming chamber (8), raw material gas supply piping (2) for supplying a raw material gas to the film forming chamber (8), reactive gas supply piping (1) for supplying a reactive gas to the film forming chamber (8), and purge gas supply piping (3) for supplying a purge gas purging the raw material gas and the reactive gas. The film forming device forms a thin film on a substrate (82) in the film forming chamber (8) by alternately performing supply of the raw material gas or supply of the reactive gas and purging. The film forming device has intermediate piping (22) and/or intermediate piping (12), both with a certain volume. The intermediate piping (22) is set in a portion or the entire portion of the raw material gas supply piping (2), and into which intermediate piping the raw material gas can be sealed when the raw material gas is not supplied. The intermediate piping (12) is set in a portion or the entire portion of the reactive gas supply piping (1), and into which intermediate piping the reactive gas can be sealed when the reactive gas is not supplied.</p>
申请公布号 WO2005067015(A1) 申请公布日期 2005.07.21
申请号 WO2004JP19239 申请日期 2004.12.22
申请人 HORIBA, LTD.;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE;RENESAS TECHNOLOGY CORP.;ROHM CO.,LTD.;TOMINAGA, KOJI;YASUDA, TETSUJI;NABATAME, TOSHIHIDE;IWAMOTO, KUNIHIKO 发明人 TOMINAGA, KOJI;YASUDA, TETSUJI;NABATAME, TOSHIHIDE;IWAMOTO, KUNIHIKO
分类号 C23C16/455;H01L21/205;H01L21/31;(IPC1-7):H01L21/205 主分类号 C23C16/455
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