| 摘要 |
PROBLEM TO BE SOLVED: To provide a construction which thins a high frequency module mounting a SAW package on a substrate and has an excellent noise proof characteristic when using a resin sealed SAW package. SOLUTION: At least a layer of resin substrate 200 is used for the substrate of the high frequency module and a through hole 117 is formed at the substrate. The SAW package 204 which flip-chip mounts a SAW element 114 on a ceramic substrate and resin seals it is mounted so that the ceramic substrate is positioned almost outside the through hole and the SAW element is positioned almost within the through hole. Earth conductors 119 and 120 are formed in an inner layer or on the rear surface of the resin substrate around the through hole. COPYRIGHT: (C)2005,JPO&NCIPI |
