发明名称 SUBSTRATE PROCESSING EQUIPMENT AND TEMPERATURE CONTROL METHOD
摘要 PROBLEM TO BE SOLVED: To perform temperature control of a temperature control object at a CVD processing section such that temperature spots are reduced. SOLUTION: A housing cooling water channel 63 is formed in the sidewall part 61 of a temperature control object, i.e. the housing, and connected with a supply pipe 81 and a discharge pipe 82 communicating with a cooling water supply source A. A heat exchanger 85 exchanges heat between cooling water before being introduced into the housing cooling water channel 63 and cooling water passed through the housing cooling water channel 63. Temperature of the cooling water being introduced into the housing cooling water channel 63 is raised by the cooling water passed through the sidewall part 61 and absorbed heat. Consequently, a temperature difference between the cooling water being introduced into the sidewall part 61 and the cooling water being led out therefrom is reduced, and temperature spots are suppressed in the sidewall part 61 which is subjected to temperature control with cooling water. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005197471(A) 申请公布日期 2005.07.21
申请号 JP20040002353 申请日期 2004.01.07
申请人 TOKYO ELECTRON LTD 发明人 NOZAWA TOSHIHISA;KOTANI KOJI
分类号 C23C16/52;H01L21/205;H01L21/304;(IPC1-7):H01L21/205 主分类号 C23C16/52
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