| 摘要 |
PROBLEM TO BE SOLVED: To provide an additive for electrolytic copper plating, which makes an article adequately plated with copper by effectively inhibiting voids from forming even in a part to be plated with a high aspect ratio, and to provide an electrolytic copper plating bath. SOLUTION: The additive for electrolytic copper plating and the electrolytic copper plating bath include (A) one or more brighteners for copper plating having at least one -S- bond, and (B) one or more sulfonic acids (salts), while controlling them to a mass ratio of (A):(B)=80:20 to 15:85. COPYRIGHT: (C)2005,JPO&NCIPI
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