发明名称 Electrolytic processing apparatus and method
摘要 There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.
申请公布号 US2005155865(A1) 申请公布日期 2005.07.21
申请号 US20040845429 申请日期 2004.05.14
申请人 MISHIMA KOJI;NAMIKI KEISUKE;HODAI MASAO;KUNISAWA JUNJI;MAKINO NATSUKI;FUKUNAGA YUKIO 发明人 MISHIMA KOJI;NAMIKI KEISUKE;HODAI MASAO;KUNISAWA JUNJI;MAKINO NATSUKI;FUKUNAGA YUKIO
分类号 C25D7/12;C25B9/00;C25D17/00;C25D17/02;C25D19/00;C25D21/00;(IPC1-7):C25B9/00 主分类号 C25D7/12
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