PRODUCTION METHOD AND DEVICE FOR IMPROVING THE BONDING BETWEEN PLASTIC AND METAL

摘要

A flat conductor frame for fitting with a semiconductor chip (2) and for covering with a plastic mass (4) has a single-piece, metal base body (3) on which an intermediate layer (5) is applied. The intermediate layer (5) has a surface (6) with a matrix of islands (14) of leftover materials having substantially a uniform height and cavities (10) extending therebetween.