发明名称 Method for manufacturing connection construction
摘要 A method for manufacturing a connection construction having a first and a second connection members bonded therebetween with a solder layer includes the steps of: sandwiching the solder layer between the first and the second connection members; decompressing the solder layer down to a first pressure with maintaining a first temperature, which is lower than a solidus of the solder; heating the solder layer up to a second temperature with maintaining the first pressure, the second temperature being higher than a luquidus of the solder; compressing the solder layer up to a second pressure with maintaining the second temperature, the second pressure being higher than the first pressure; and hardening the solder with maintaining the second pressure.
申请公布号 US2005156324(A1) 申请公布日期 2005.07.21
申请号 US20050036135 申请日期 2005.01.18
申请人 DENSO CORPORATION & TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 NAKASE YOSHIMI;SAKAMOTO YOSHITAUGU;OHKI HIROSHI;YOSHIDA TOMOMASA;KANO NORIO
分类号 B23K1/00;H01L21/58;H01L21/60;H01L23/48;H01L23/52;(IPC1-7):H01L23/48 主分类号 B23K1/00
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