发明名称 |
Method for manufacturing connection construction |
摘要 |
A method for manufacturing a connection construction having a first and a second connection members bonded therebetween with a solder layer includes the steps of: sandwiching the solder layer between the first and the second connection members; decompressing the solder layer down to a first pressure with maintaining a first temperature, which is lower than a solidus of the solder; heating the solder layer up to a second temperature with maintaining the first pressure, the second temperature being higher than a luquidus of the solder; compressing the solder layer up to a second pressure with maintaining the second temperature, the second pressure being higher than the first pressure; and hardening the solder with maintaining the second pressure. |
申请公布号 |
US2005156324(A1) |
申请公布日期 |
2005.07.21 |
申请号 |
US20050036135 |
申请日期 |
2005.01.18 |
申请人 |
DENSO CORPORATION & TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
NAKASE YOSHIMI;SAKAMOTO YOSHITAUGU;OHKI HIROSHI;YOSHIDA TOMOMASA;KANO NORIO |
分类号 |
B23K1/00;H01L21/58;H01L21/60;H01L23/48;H01L23/52;(IPC1-7):H01L23/48 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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