发明名称 METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide metal-containing resin particles by which a metal-containing resin layer can be formed with good accuracy and a method for manufacturing an electronic circuit, and resin particles by which the resin layer can be formed with good accuracy, and to provide a method for manufacturing an electronic circuit. <P>SOLUTION: The surface of a photoreceptor drum 11 is electrostatically charged, and an electrostatic latent image of a prescribed pattern is formed on the surface of the electrostatically charged photoreceptor drum 11. A visible image is formed on the surface of the photoreceptor drum 11 formed with the electrostatic latent image, by electrostatically making the metal-containing resin particles 2a composed of a resin containing &ge;50wt% thermosetting resin adhere and having an amount of moisture absorption of 500 to 14,500 ppm and metallic particulates incorporated into the resin or the resin particles 4a composed of the resin containing &ge;50wt% thermosetting resin, and having amount of moisture absorption of 500 to 14,500 ppm. The visible image, which is composed of the metal-containing resin particles 2a or the resin particles 4a and is formed on the surface of the photoreceptor drum 11, is transferred to a base 1, and the visible image transferred onto the base 1 is fixed to the base 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005195690(A) 申请公布日期 2005.07.21
申请号 JP20030435758 申请日期 2003.12.26
申请人 TOSHIBA CORP 发明人 YAMAGUCHI NAOKO;AOKI HIDEO;TAKUBO TOMOAKI
分类号 G03G9/08;B32B3/00;G03G9/087;H01L21/00;H01L21/02;H01L21/027;H01L23/12;H01L23/498;H05K1/09;H05K3/10;H05K3/12;H05K3/24;H05K3/46 主分类号 G03G9/08
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