| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently provide piezoelectric components without a waste in response to the rapidly tightened requirement of downsizing for the piezoelectric components. <P>SOLUTION: In order to solve the task above, the piezoelectric component for containing a piezoelectric element adopts an enclosed package structure for the piezoelectric element by arranging a substrate mounting the piezoelectric element, locating a substrate acting like a spacer on the substrate mounting the piezoelectric element, and arranging a substrate for drive components of an electronic apparatus to the spacer substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
