发明名称 USE AND MANUFACTURING PROCESS OF ELECTROSTATIC CAPACITY TYPE THIN FILM TOUCH PAD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electrostatic capacity type touch pad which uses thin films for cost reduction, and its manufacturing process. <P>SOLUTION: The electrostatic capacity type touch pad is equipped with a sheet of a thin film layer and a sheet of a printed circuit board. The thin film has traces in two directions, and the printed circuit board has a first conductive layer and a second conductive layer on both sides of a ground plane. Bonding pads the first conductive layer has are joined to the traces in the two directions, and further connected to the first conductive layer and a second conductive layer through vias. The manufacture of the electrostatic capacity type touch pad is divided into that of the thin film and that of the printed circuit board. Jointing is performed with a conductive adhesive, or a thin film is printed on a printed circuit board as a substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005197200(A) 申请公布日期 2005.07.21
申请号 JP20040092294 申请日期 2004.03.26
申请人 ELAN MICROELECTRONICS CORP 发明人 CHIU YEN-CHANG;CHIEN YUNG-LIEH
分类号 H01H13/00;G06F3/00;G06F3/044;G09G5/00;H01H11/00;(IPC1-7):H01H13/00 主分类号 H01H13/00
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