发明名称 THIN WIRY STRUCTURE ASSEMBLING METHOD, QUANTUM DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPLICATION DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thin wiry structure assembling method for mounting a thin wiry structure represented by a quantum thin wire such as a silicon nanowire at a predetermined location in a self-aligning manner in a predetermined orientation. SOLUTION: According to the method, a dispersion liquid obtained by dispersing the thin wiry structures such as the silicon nanowires 17, is made to flow on a surface of a substrate 11 in the predetermined orientation, and a binding portion (gold nanoparticle 21) at one end of each thin wiry structure is joined to a predetermined binding portion (-SH group) on the surface of the substrate 11. Alternatively the thin wiry structure is dispersed in a compound having a first functional group bindable to the predetermined binding portion on the surface of the substrate and a second functional group bindable to the one end of each thin wiry structure, and a dispersed liquid in which the one end of the thin wiry structure is joined to the second functional group of the compound, is made to flow on the surface of the substrate in the predetermined orientation, to thereby join the first functional group of the compound to the predetermined binding portion on the surface of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005193362(A) 申请公布日期 2005.07.21
申请号 JP20040004618 申请日期 2004.01.09
申请人 SONY CORP 发明人 MACHIDA AKIO;KAMEI TAKAHIRO
分类号 B82B3/00;H01L29/06;H05K3/40;(IPC1-7):B82B3/00 主分类号 B82B3/00
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