| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which can be used as a sealing medium for a semiconductor device, gives a cured product having excellent moisture-resistant reliability and toughness, prevents defects from occurring even when the reflow temperature is raised to 260-270°C from the conventional temperature near 240°C, further does not deteriorate the quality of the product also under a high temperature and a high humidity such as PCT (pressure cooker test) (121°C/2.1 atm), and generates no peeling-off and crack even when it is used over several hundreds of temperature cycles of -65°C/150°C, and to provide a semiconductor device sealed with this cured product of the composition. SOLUTION: The liquid epoxy resin composition comprises as essential components (A) a liquid epoxy resin, (B) an aromatic amine-based curing agent containing not less than 5 mass% of an aromatic amine compound represented by formula (1) (in the formula, each of R<SP>1</SP>-R<SP>3</SP>is independently a group selected from a 1-6C monovalent hydrocarbon group, CH<SB>3</SB>S- and C<SB>2</SB>H<SB>5</SB>S-), and (C) an inorganic filler having an average particle diameter of greater than 5μm, wherein the inorganic filler (C) is mixed in an amount of 300-1,000 pts. mass against 100 pts. mass of the total of the liquid epoxy resin (A) and the aromatic amine-based curing agent (B). COPYRIGHT: (C)2005,JPO&NCIPI
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