AN INTEGRAL TOPSIDE VACCUM PACKAGE

摘要

An integrated vacuum package having an added volume on a perimeter within th e perimeter of a bonding seal between two wafers. The added volume of space ma y be an etching of material from the inside surface of the top wafer. This waf er may have vent holes that may be sealed to maintain a vacuum within the volum e between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflecti ve pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.