| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounting semiconductor device improving the heat-dissipating properties of each lead frame while reducing stress in the case of a forming by a simple constitution and the lead-frame structure of the semiconductor device. <P>SOLUTION: The surface-mounting semiconductor device 10 is constituted so as to contain a pair of the lead frames 11 and 12 abutted against each other at an interval so that ends are opposed to each other, a bare chip 13 mounted on a chip mounting section 11b on one end side of one lead frame and wire-bonded with a connecting section on one end side of the other lead frame and a housing 14 insert-molded to one end side of both lead frames. The semiconductor device 10 is constituted so that each lead frame is extended to side faces and underside of the housing and shaped by the forming so as to form terminals for surface mounting. The semiconductor device 10 is constituted so that each lead frame is formed in a thin shape in a region where the frame is bent by at least forming, while the lead frame is formed in a thick shape for improving a heat-dissipating effect in the other region. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
