| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition apparatus where the structure of deposition arrangement for depositing a thin film on a wafer 24 with high uniformity is simplified, and the failure rate of the deposition arrangement is reduced, and its repair is facilitated. SOLUTION: The deposition apparatus includes a deposition boat 10 installed in the bottom at the inside of a vacuum chamber 40 to vaporize the deposition material, a wafer guide 20 on which the wafer 24 is loaded, having a rotational member 26 rotating together with the loaded wafer 24, a wafer-rotation device 60 rotating the rotational member 26 when the wafer guide 20 approaches, and a wafer-transfer device 30 reciprocating the wafer guide 20 between an inlet 45 of the vacuum chamber, the deposition boat 10 and the wafer-rotation device 60. At this time, the deposition apparatus may include a deposition preventive wall 50 vertically formed between the deposition boat 10 and the wafer-transfer device 30 for the purpose of preventing the deposition of the vaporized deposition material on the wafer-transfer device 30 as well. COPYRIGHT: (C)2005,JPO&NCIPI
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