发明名称 Photosensitive resin composition for black matrix
摘要 A photosensitive resin composition for a black matrix comprises (A) an alkali-soluble resin; (B) a photopolymerizable monomer; (C) a photoinitiator; (D) a solvent; and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1); viscosity of said photosensitive resin composition for the black matrix is 0.5-4.0 cps at 25° C.; the solid content of said photosensitive resin composition is 5-25 wt. %; and said solvent (D) has a saturated vapor pressure below 4.5 mm-Hg at 20° C.; which presents no pinhole on the surface after low pressure drying, no line and cloud defect on the film, good inner uniformity of the coated film and high photosensitivity after pre-bake, high heat resistance for black matrix after post-bake; which can be coated on the substrate, specifically the large-sized substrate, of liquid crystal display by the slit coating process. (Each of R is independently H, linear or branch alkyl of C1-C5, phenyl or halogen.)
申请公布号 US2005158659(A1) 申请公布日期 2005.07.21
申请号 US20040846566 申请日期 2004.05.17
申请人 LEE CHUN-HSIEN 发明人 LEE CHUN-HSIEN
分类号 G03F7/004;C08F290/14;G02B5/00;G02B5/20;G03C1/76;G03F7/00;G03F7/027;G03F7/032;H01L21/027;(IPC1-7):G03C1/76 主分类号 G03F7/004
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