| 摘要 |
Provided is an electronic component permitting lead wires or the like to be securely soldered to a plurality of respective terminal electrodes connected to electroconductive members in through holes. On a surface 7 a of a stack-type piezoelectric device being an electronic component, a lead wire is soldered to a second electrode layer 23 on one end side in the longitudinal direction of one terminal electrode 17 out of two adjacent terminal electrodes, and a lead wire is soldered to a second electrode layer 23 on the other end side in the longitudinal direction of the other terminal electrode 17 . Since the one end side of one terminal electrode 17 and the other end side of the other terminal electrode 17 are located on the side opposite to the side where each terminal electrode is connected to an electroconductive member 14 in a through hole 13 , it is feasible to prevent the electroconductive member 14 in the through hole 13 from dissolving into a molten solder 25 . In addition, solders 25 are prevented from adjoining in the direction perpendicular to the longitudinal direction of the terminal electrodes 17 , and it is thus feasible to prevent solders 25 from joining together between adjacent terminal electrodes 17, 17.
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