发明名称 DUAL CHIP PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a dual chip package, which is memory chips including memories respectively having different address systems, capable of freely accessing to the memories of the respective memory chips. SOLUTION: The dual chip package includes two memory chips. The respective memory chips include a buffer memory and a flash memory having different address systems. The respective memory chips include a register for storing first and second flag signal respectively indicating selection of the memory chip and selection of the buffer memory, a comparison circuit for respectively comparing the first and second flag signals stored in the register with a reference signal, and respectively generating a flash access signal and a buffer access signal, and a controller for responding to the flash access signal and the buffer access signal and controlling the buffer memory and the flash memory. Thereby, the buffer memory and the flash memory of the respective memory chips are freely accessed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005196739(A) 申请公布日期 2005.07.21
申请号 JP20040322826 申请日期 2004.11.05
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE JIN-YUB
分类号 G06F12/06;G06F12/00;G11C5/00;G11C7/02;G11C8/12;H01L23/48;H01L25/04;H01L25/18;H01L27/10;(IPC1-7):G06F12/06 主分类号 G06F12/06
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