| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist composition which enables supplying of solder, only to contact pads with no residual solder ball on a solder resist, in soldering of a printed wiring board. <P>SOLUTION: The alkali-developable photosensitive resin composition comprises (A) a carboxylic resin having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a reactive diluent, (D) a water-soluble silicone and (E) a polyfunctional epoxy compound, having two or more epoxy groups in one molecule. A printed wiring board, with a solder resist formed using the composition, is provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
