发明名称 Method of forming an STI feature to avoid electrical charge leakage
摘要 A method for forming shallow trench isolation (STI) structure including providing a substrate comprising an overlying hardmask layer; patterning the hardmask layer to form a hardmask layer opening for etching a trench through a substrate thickness portion; etching a trench according to the patterned overlying hardmask layer; carrying out a wet chemical oxidizing process to form an oxidized surface portion on the hardmask layer; carrying out a wet chemical etching process to remove at least a portion of the oxidized surface portion to form the hardmask opening having an enlarged width and the trench opening comprising rounded upper corners; and, forming a completed planarized STI structure filled with oxide.
申请公布号 US2005158964(A1) 申请公布日期 2005.07.21
申请号 US20040761656 申请日期 2004.01.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHIU YIH S.;HUANG JAO S.;TSAI WEN T.;LEU CHEN H.
分类号 H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/762
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