| 摘要 |
A semiconductor device by embedded package has a good mechanical property for assembly on the machine, especially for installation on a vehicle. The semiconductor device by embedded package can usually act as a power diode and has a nail head having a bonding end and a leading conductor, and a metal housing having a cavity inside. A bonding stage is formed on the metal housing within the cavity. A semiconductor chip is installed on the bonding stage with two sides connected to the nail head and the bonding stage respectively. The bonding stage has a fence at the edge thereof A well is formed around the bonding stage inside the cavity thereof. The metal housing has a inner side wall around the well and encloses the cavity.
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